Semiconductor device and production method therefor
AssigneeHitachi Chemical Company, Ltd.
InventorsKazutaka Honda, Akira Nagai, Makoto Satou
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Abstract
A manufacturing method for a semiconductor device in which connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or a semiconductor device in which connection portions of a plurality of semiconductor chips are electrically connected to each other, the method comprising a step of sealing at least part of the connection portions with an adhesive for a semiconductor comprising a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group.
Claims12
A manufacturing method for a semiconductor device, wherein connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or connection portions of a plurality of semiconductor chips are electrically connected to each other,
- the method comprising:
- a step of laminating a film-shaped adhesive for a semiconductor on the semiconductor chip, the adhesive for a semiconductor comprising a compound having a group represented by the following formula (1):
- wherein R1 represents an electron-donating group;
- and
- a step of sealing at least part of the connection portions with a cured product of the adhesive for a semiconductor.
Dependencies are inferred from the claim text.