Electronic component having a corrosion-protected bonding connection and method for producing the component

An electronic component having a corrosion-protected bonding connection, comprising:

• at least one semiconductor chip (3) on a substrate (4);
• at least one bonding connection at risk of corrosion on the semiconductor chip (3);
• and
• a package (5) hermetically enclosing the at least one semiconductor chip (3) and the at least one bonding connection at risk of corrosion,
• the bonding connection being a bonding wire connection (2), and the bonding wire connection (2) being completely hermetically enclosed in the package (5) and the substrate (4) being at least partially hermetically enclosed in the package (5), and at least one surface-mountable hydrolysis-sensitive component (6) being arranged on the substrate (4);
• wherein the hydrolysis-sensitive component (6) comprises a hydrolysis-sensitive core material (11), the core material (11) being able to getter water molecules of an atmosphere of an interior space (12) of the package (5);
• the core material (11) of the hydrolysis-sensitive component (6) having a semipermeable coating at least on an upper side (7) and a peripheral surface (9) of the hydrolysis-sensitive component (6), and the semipermeable coating supporting the form of the hydrolysis-sensitive component (6) during saponification and loss of form and is permeable to water molecules.