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US 9,425,114 B2Granted
Flip chip packages
AssigneeOracle International Corporation
InventorAshur Bet-Shliemoun
Life of this patent
Estimating the term…
Abstract
A flip chip package includes a substrate, a silicon die supported on and electrically connected with the substrate, and a lid attached with the substrate and covering the silicon die. The silicon die has a die surface including a first set of tracks formed therein, and the lid may have a lid surface including a second set of tracks formed therein. A thermal interface material may be disposed between the die surface and lid surface and at least partially fill the first and second sets of tracks.
Claims10
A lid-less flip chip package comprising:
- a substrate;
- a silicon die supported on and electrically connected with the substrate;
- and
- one or more support structures supported on the substrate and positioned around the silicon die without covering the silicon die, wherein the silicon die and support structures cooperate to support a heat sink such that the silicon die and support structures distribute compression loads associated with the heat sink to the substrate, wherein the silicon die has a side including one or more tracks formed therein, and wherein the side is positioned to be adjacent to the heat sink.
1 more element
Dependencies are inferred from the claim text.