Package for high frequency circuits
AssigneeRadio Physics Solutions, Ltd.
InventorsJim Yip, Paul Rice, Mark Black
Life of this patent
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Abstract
The present invention relates to integrated circuit packaging and methods of manufacturing these. In particular, but not exclusively the present invention relates to improvements in the suppression of spurious wave modes within cavity packages in which are mounted circuits operating at high frequencies, for example Monolithic Microwave Integrated Circuits (MMIC's).
Claims18
A package having a cavity for high frequency electrical circuits capable of generating resonant wave modes in a range of orientations within the cavity, the cavity formed within a first material for containment of the electrical circuit, wherein the package additionally comprises a second material comprising a plurality of elongated members of gradually decreasing cross-section towards an apex thereof, wherein each member extends into the cavity and comprises a partially conductive region, the plurality of members configured to uniformly absorb all resonant wave modes across the range of orientations, wherein the package is a universal system for suppression of resonant wave modes independent of the type of high frequency electrical circuit housed within the cavity.
Dependencies are inferred from the claim text.