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US 9,425,107 B2Granted
Memory device and method for manufacturing the same
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorDaisuke Matsubayashi
Life of this patent
Estimating the term…
Abstract
A memory device that is as small in area as possible and has an extremely long data retention period. A transistor with extremely low leakage current is used as a cell transistor of a memory element in a memory device. Moreover, in order to reduce the area of a memory cell, the transistor is formed so that its source and drain are stacked in the vertical direction in a region where a bit line and a word line intersect each other. Further, a capacitor is stacked above the transistor.
Claims30
A memory device comprising:
- an insulating surface;
- a transistor over the insulating surface, the transistor comprising a bit line, a semiconductor layer, a gate insulating layer, and a word line, the gate insulating layer being interposed between a side face of the semiconductor layer and the word line;
- and
- a capacitor overlapping the transistor, the capacitor comprising an insulating layer interposed between a capacitor electrode and a capacitor line, the capacitor electrode being in electrical contact with the semiconductor layer,
- wherein a top surface of the semiconductor layer, a top surface of the gate insulating layer, and a top surface of the word line are in a same horizontal plane,
- wherein the bit line, the semiconductor layer, the capacitor electrode, the insulating layer, and the capacitor line are stacked in this order, and
- wherein the semiconductor layer comprises a semiconductor material having a wider band gap than silicon.
4 more elements
A semiconductor device comprising:
- an insulating surface;
- a first conductive layer formed over the insulating surface;
- a semiconductor layer formed over and in electrical contact with the first conductive layer;
- a second conductive layer formed over and in electrical contact with the semiconductor layer;
- an insulating layer formed over the second conductive layer;
- a third conductive layer formed over the insulating layer and overlapping the second conductive layer and the semiconductor layer;
- a fourth conductive layer facing a side face of the semiconductor layer;
- and
- a gate insulating layer interposed between the fourth conductive layer and the semiconductor layer,
- wherein a top surface of the semiconductor layer, a top surface of the gate insulating layer, and a top surface of the fourth conductive layer are in a same horizontal plane, and
- wherein the semiconductor layer comprises a semiconductor material having a wider band gap than silicon.
8 more elements
A memory device comprising:
- an insulating surface;
- a first transistor over the insulating surface, the first transistor comprising a first bit line, a first semiconductor layer over the first bit line, a first capacitor electrode, and a first gate insulating layer, the first semiconductor layer being interposed between and in electrical contact with the first bit line and the first capacitor electrode;
- a second transistor over the insulating surface, the second transistor comprising a second bit line, a second semiconductor layer over the second bit line, a second capacitor electrode, and a second gate insulating layer, the second semiconductor layer being interposed between and in electrical contact with the second bit line and the second capacitor electrode;
- a word line facing a side surface of the first semiconductor layer and a side surface of the second semiconductor layer with the first gate insulating layer and the second gate insulating layer interposed between the word line and, respectively, the first semiconductor layer and the second semiconductor layer;
- an insulating layer covering the first and the second capacitor electrodes;
- a capacitor line over the insulating layer;
- a capacitor comprising the first capacitor electrode, the insulating layer, and the capacitor line,
- wherein the word line completely fills a space separating the first and the second semiconductor layers, except for a volume occupied by the first and the second gate insulating layers, and
- wherein the first and the second semiconductor layers each comprise a semiconductor material having a wider band gap than silicon.
6 more elements
A memory device comprising:
- a transistor comprising:
- an oxide semiconductor material comprising indium and zinc over a substrate, the oxide semiconductor material including a channel formation region which extends vertically to the substrate;
- and
- a gate insulating material on a side surface of the oxide semiconductor material;
- and
- a capacitor operationally connected with the transistor, the capacitor comprising:
- a capacitor electrode on and in direct contact with an upper surface of the oxide semiconductor material, the capacitor electrode laterally extending beyond the gate insulating material;
- and
- a first insulating layer over the capacitor electrode,
- wherein a top surface of the oxide semiconductor material and a top surface of the gate insulating material are in a same horizontal plane.
7 more elements
Dependencies are inferred from the claim text.