Radio-frequency device package and method for fabricating the same

A method for fabricating an electronic device package, comprising:

• providing a electronic device chip, wherein the electronic device chip comprises:
• a semiconductor substrate having a front side and a back side, wherein the semiconductor substrate has a first thickness;
• an electronic component disposed on the front side of the semiconductor substrate;
• and
• an interconnect structure disposed on the electronic component, wherein the interconnect structure is electrically connected to the electronic component;
• performing a thinning process to remove a portion of the semiconductor substrate from the back side thereof, thereby forming a thinned semiconductor substrate having a second thickness less than the first thickness;
• removing a portion of the thinned semiconductor substrate and a portion of a dielectric layer of the interconnect structure from a back side of the thinned semiconductor substrate until a first metal layer pattern of the interconnect structure is exposed, thereby forming a through hole;
• and
• forming a TSV structure in the through hole;
• and
• mounting the electronic device chip on a base, wherein the back side of the thinned semiconductor substrate is closer to the base than a front side of the thinned semiconductor substrate.