Back to results
US 9,425,088 B2Granted
Manufacturing method of semiconductor device
AssigneeSocionext Inc.
InventorsTakumi Ihara, Seiji Ueno, Joji Fujimori, Yasunori Fujimoto
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes: a substrate; a semiconductor element installed on the substrate so that a surface formed with an electrode is directed to the substrate; a chip capacitor installed on the substrate; and a conductive material covering a rear surface opposite to the surface of the semiconductor element and joining to one terminal electrode of the chip capacitor.
Claims12
A manufacturing method of a semiconductor device, comprising:
- putting a chip capacitor, that includes a first terminal electrode and a second terminal electrode, on a substrate;
- putting a semiconductor element on the substrate so that a first surface of the semiconductor element faces the substrate;
- disposing a conductive material on a second surface of the substrate that is opposite to the first surface so that the conductive material is directly connected to the first terminal electrode;
- and
- disposing a heat radiation plate on the conductive material,
- wherein the heat radiation plate includes an inhibiting portion that inhibits the conductive material from being brought into contact with the second terminal electrode.
3 more elements
A manufacturing method of a semiconductor device, comprising:
- forming a conductive layer on a substrate;
- disposing a chip capacitor, that includes a first terminal electrode and a second terminal electrode, on the substrate so that the conductive layer is connected to the first terminal electrode;
- putting a semiconductor element on the substrate so that a first surface of the semiconductor element faces the substrate;
- disposing a conductive material on a second surface of the semiconductor element that is opposite to the first surface so that the conductive layer is directly connected to the first terminal electrode;
- and
- disposing a heat radiation plate on the conductive material,
- wherein the heat radiation plate includes an inhibiting portion that inhibits the conductive material from being brought into contact with the second terminal electrode.
4 more elements
Dependencies are inferred from the claim text.