Handle substrate, composite substrate for semiconductor, and semiconductor circuit board and method for manufacturing the same
AssigneeNGK Insulators, Ltd.
InventorsSugio Miyazawa, Yasunori Iwasaki, Tatsuro Takagaki, Akiyoshi Ide, Hirokazu Nakanishi
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Abstract
It is provided a handle substrate of a composite substrate for a semiconductor. The handle substrate is composed of a translucent polycrystalline alumina. A purity of alumina of the translucent polycrystalline alumina is 99.9% or higher, an average of a total forward light transmittance of the translucent polycrystalline alumina is 60% or higher in a wavelength range of 200 to 400 nm, and an average of a linear light transmittance of the translucent polycrystalline alumina is 15% or lower in a wavelength range of 200 to 400 nm.
Claims7
A handle substrate of a composite substrate for a semiconductor, said handle substrate comprising a translucent polycrystalline alumina:
- wherein a purity of alumina of said translucent polycrystalline alumina is 99.9% or higher;
- wherein an average of a total forward light transmittance of said translucent polycrystalline alumina is 60% or higher in a wavelength range of 200 to 400 nm, and
- wherein an average of a linear light transmittance of said translucent polycrystalline alumina is 15% or lower in a wavelength range of 200 to 400 nm.
A method of manufacturing a semiconductor circuit board, said semiconductor circuit board comprising a handle substrate, a donor substrate bonded to a bonding surface of said handle substrate and a circuit provided on said donor substrate, the method comprising the steps of:
- preparing a component, said component comprising a base substrate comprising a translucent polycrystalline alumina and having a bonding surface and an opposed surface, a donor substrate bonded to a bonding surface of said base substrate, and a circuit provided on said donor substrate, wherein a purity of alumina of said translucent polycrystalline alumina is 99.9% or higher, an average of a total forward light transmittance of said translucent polycrystalline alumina is 60% or higher in a wavelength range of 200 to 400 nm, and an average of a linear light transmittance of said translucent polycrystalline alumina is 15% or lower in a wavelength range of 200 to 400 nm;
- forming said handle substrate by processing said base substrate from a side of said opposed surface to thereby decrease a thickness of said base substrate;
- and
- irradiating ultraviolet rays in a wavelength range of 200 to 400 nm to a ultraviolet curable resin from a side of said handle substrate, thereby curing said ultraviolet curable resin, while said ultraviolet curable resin is placed to intervene between said donor substrate and a supporting body.
Dependencies are inferred from the claim text.