Semiconductor apparatus with transportable edge ring for substrate transport

An apparatus for processing semiconductor substrates, said apparatus comprising:

• a rotatable disc having an upper surface capable of receiving a semiconductor substrate thereon and having a terraced outer edge including an upper edge portion, an intermediate edge portion and a lower edge portion, said intermediate edge portion having an intermediate outer diameter greater than an upper outer diameter of said upper edge portion and less than a lower outer diameter of said lower edge portion, wherein said substrate contacts said disc while said disc is rotating;
• an edge ring adapted and sized to be disposed on a top surface of said intermediate edge portion, said edge ring including a horizontal surface substantially coplanar with a top surface of said rotatable disc and a vertical portion circumferentially outside said horizontal surface, wherein said upper surface and said horizontal surface of said edge ring are shaped and sized to receive a substrate thereon, and said upper surface has an outer diameter smaller than said substrate;
• and
• a wafer blade assembly including at least a pair of substrate lifting blades, said substrate lifting blades spaced apart by a distance substantially equal to said intermediate outer diameter.