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US 9,425,069 B2Granted
Electronic modules
AssigneeThe Charles Stark Draper Laboratory, Inc.
InventorsLivia M. Racz, Gary B. Tepolt, Jeffrey C. Thompson, Thomas A. Langdo, Andrew J. Mueller
Life of this patent
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Abstract
Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
Claims18
A structure, comprising:
- a substrate defining at least one fill hole in a first side thereof and a cavity in a second side thereof, the cavity being in fluidic communication with the at least one fill hole;
- a dielectric adhesive layer disposed over the cavity on the second side of the substrate, the dielectric adhesive layer at least partially sealing the cavity on the second side of the substrate;
- and
- a microelectronic die adhered to the dielectric adhesive layer and at least partially encapsulated within the cavity by an encapsulant.
1 more element
An electronic module comprising:
- a substrate having a back surface and a front surface opposing the back surface, the back surface defining at least one fill hole and the front surface defining a cavity in fluidic communication with the at least one fill hole;
- a dielectric layer attached to the front surface of the substrate and disposed over the cavity of the front surface of the substrate, the dielectric layer at least partially sealing the cavity on the front surface of the substrate;
- a microelectronic die coupled to the dielectric layer and depending at least partially into the cavity;
- and
- an encapsulant filling the at least one fill hole and cavity to encapsulate the microelectronic die in the cavity.
2 more elements
A high density electronic assembly comprising:
- a first electronic module coupled to a second electronic module, each electronic module including:
- a substrate having a back surface and a front surface opposing the back surface, the back surface including at least one fill hole and the front surface defining a cavity;
- a dielectric layer attached to the front surface of the substrate and disposed over the cavity of the front surface of the substrate, the dielectric layer at least partially sealing the cavity on the front surface of the substrate;
- a microelectronic die coupled to the dielectric layer and disposed at least partially into the cavity;
- an encapsulant filling the at least one fill hole and cavity to encapsulate the microelectronic die in the cavity;
- and
- a backside interconnection layer connected to the microelectronic die, wherein the backside interconnection layers of the first and second electronic modules are directly connected together.
4 more elements
Dependencies are inferred from the claim text.