Processing apparatus having a first shield and a second shield arranged to sandwich a substrate

A processing apparatus comprising:

• a vacuum vessel;
• a supply source including a first supply source and a second supply source arranged to respectively face a first surface of a substrate conveyed into the vacuum vessel and a second surface on an opposite side to the first surface and configured to supply a material to apply a process to the substrate;
• a shield member including a first shield provided around the first supply source and a second shield provided around the second supply source, the first shield and the second shield being arranged to sandwich the substrate;
• and
• a moving device configured to move the first shield and the second shield to set one of a first state in which the first shield and the second shield are arranged with respect to each other so as to form process spaces between the first shield and the second shield, and a second state in which the first shield and the second shield are further apart from each other than when in the first state,
• wherein the shield member forms the process spaces between the first supply source and the substrate and between the second supply source and the substrate when the moving device moves the first shield and second shield to set the first state, and
• the process is applied to the first surface and the second surface in the process spaces,
• wherein the first shield includes a first convex portion protruding toward the second shield,
• the second shield includes a first concave portion corresponding to the first convex portion, and
• when the moving device moves the first shield and the second shield to set the first state, the first convex portion and the first concave portion constitute a nested structure for preventing the material generated in the process spaces from leaking from the process spaces to an outside space.

A processing apparatus comprising:

• a vacuum vessel;
• a supply source including a first supply source and a second supply source arranged to respectively face a first surface of a substrate conveyed into the vacuum vessel and a second surface on an opposite side to the first surface and configured to supply a material to apply a process to the substrate;
• a shield member including a first shield provided around the first supply source and a second shield provided around the second supply source, the first shield and the second shield being arranged to sandwich the substrate;
• and
• a moving device configured to move the first shield and the second shield to set one of a first state in which the first shield and the second shield are arranged with respect to each other so as to form process spaces between the first shield and the second shield, and a second state in which the first shield and the second shield are further apart from each other than when in the first state,
• wherein the shield member forms the process spaces between the first supply source and the substrate and between the second supply source and the substrate when the moving device moves the first shield and second shield to set the first state, and
• the process is applied to the first surface and the second surface in the process spaces,
• wherein each of the first shield and the second shield includes a shaft portion extending to an opposite side to a substrate conveyed into the vacuum vessel, and
• the moving device moves the first shield and the second shield via the shaft portion.