Back to results
US 9,418,885 B2Granted
Semiconductor manufacturing apparatus
AssigneeLG Innotek Co., Ltd.
InventorsKi Bum Sung, Jo Young Lee, Mhan Joong Kim, Chang Geun Ahn, Jung Hyun Kim
Life of this patent
Estimating the term…
Abstract
Disclosed is a semiconductor manufacturing apparatus including at least one pocket on which a passive subject on which deposition will be executed is mounted, and a carrier body having an insertion space to which the at least one pocket is detachably attached. Therefore, the semiconductor manufacturing apparatus shortens process time and reduces process expenses. The semiconductor manufacturing apparatus allows respective pockets to have different structures according to the positions of the pockets on the wafer carrier, and thus achieves uniform growth of a material on the surfaces of wafers regardless of the positions of the pockets.
Claims11
A semiconductor manufacturing apparatus, comprising:
- at least one pocket on which a passive subject on which deposition will be executed is mounted;
- and
- a carrier body having an insertion space to which the at least one pocket is attached,
- wherein each pocket is individually attached and is independently detachable, and
- wherein the at least one pocket includes:
- a rear coupling part formed on a rear surface of the at least one pocket and coupled to the carrier body;
- and
- a front support part formed on a front surface of the at least one pocket, and the front support part supports the passive subject,
- wherein the front support part includes:
- a first inner side surface extended in a first direction in which the at least one pocket is inserted into the carrier body,
- a first inner bottom surface extended from the first inner side surface in a second direction different from the first direction, and an edge of the passive subject is provided on the first inner bottom surface,
- a second inner side surface extended from the first inner bottom surface in the first direction, and
- a second inner bottom surface extended from the second inner side surface in the second direction and corresponding to a bottom of the at least one pocket,
- wherein the carrier body and the rear coupling part have shapes corresponding to each other so as to be coupled to each other,
- wherein a center of the second inner bottom surface is thinner than an edge of the second inner bottom surface, wherein the rear coupling part includes:
- a first outer side surface extended in the first direction on a side of the at least one pocket opposite to the first inner side surface;
- a first outer bottom surface extended from the first outer side surface in the second direction on the side of the at least one pocket opposite to the first inner bottom surface;
- and
- a second outer side surface extended from the first outer bottom surface in the first direction on the side of the at least one pocket opposite to the second inner side surface.
16 more elements
A semiconductor manufacturing apparatus, comprising:
- a carrier body having a plurality of insertion spaces;
- and
- a plurality of pockets to be individually provided in corresponding ones of the insertion spaces, and each pocket is independently detachable from a corresponding insertion space, and
- wherein each pocket includes:
- a support at a surface of the pocket to support a passive object, wherein the support includes:
- a first inner side surface that extends in a first direction,
- a first inner bottom surface that extends from the first inner side surface in a second direction different from the first direction, and an edge of the passive object is on the first inner bottom surface,
- a second inner side surface that extends from the first inner bottom surface in the first direction, and
- a second inner bottom surface that extends from the second inner side surface in the second direction, wherein the second inner bottom surface has a concave shape,
- a rear coupling at a surface of the pocket and coupled to the carrier body, wherein the carrier body and the rear coupling have shapes corresponding to each other, wherein the rear coupling includes:
- a first outer side surface that extends in the first direction on a side of the pocket opposite to the first inner side surface;
- a first outer bottom surface that extends from the first outer side surface in the second direction on the side of the pocket opposite to the first inner bottom surface;
- a second outer side surface that extends from the first outer bottom surface in the first direction on the side of the pocket opposite to the second inner side surface;
- and
- a second outer bottom surface that extends from the second outer side surface in the second direction on the side of the at least one pocket opposite to the second inner bottom surface.
12 more elements
Dependencies are inferred from the claim text.