Photoresist composition and method for forming a metal pattern

A method of forming a metal pattern, the method comprising:

• forming a metal layer on a base substrate;
• coating a photoresist composition on the metal layer to form a coating layer without performing a vacuum conductive drying, the photoresist composition comprising a binder resin, a photo-sensitizer and a mixed solvent including a first solvent, a second solvent having a higher volatility than the first solvent, and a third solvent having a higher volatility than the second solvent, wherein the first solvent comprises propylene glycol monomethyl ether acetate and the third solvent comprises n-propyl acetate, and wherein the mixed solvent comprises about 30% to about 70% by weight of the first solvent, about 10% to about 50% by weight of the second solvent and about 10% to about 50% by weight of the third solvent based on a total weight of the mixed solvent;
• exposing the coating layer to light;
• partially removing the coating layer to form a photoresist pattern;
• and
• patterning the metal layer by using the photoresist pattern as a mask.