Electronic component, manufacturing method for electronic component, electronic apparatus, and moving object

A manufacturing method for an electronic component including a substrate that is provided with a connection terminal;

• and a lead terminal that includes a first surface, a second surface which is a rear surface of the first surface, and a third surface which connects the first surface to the second surface, and includes a connection pad, a lead portion connected to the connection pad, and a lead end portion provided at the lead portion on an opposite side to the connection pad, in which the first surface of the connection pad is connected to the connection terminal via a joining member, and in which the lead portion includes a first bent section that is bent in a direction intersecting the first surface or the second surface;
• a second bent section that is bent in a direction intersecting the third surface between the first bent section and the lead end portion;
• and a third bent section that is bent in a direction intersecting the first surface or the second surface between the second bent section and the lead end portion, the first surface and the second surface being substantially flat between the first bent section and the second bent section, the manufacturing method comprising:
• connecting the connection pad of the lead terminal provided with the second bent section to the connection terminal;
• and
• forming the first bent section and the third bent section.

An electronic component comprising:

• a substrate that is provided with a connection terminal;
• and
• a lead terminal that includes
• a lead portion extending along a first direction;
• a connection pad extending along a second direction intersecting the first direction;
• a lead end portion extending along the second direction;
• a first bent section connecting the lead portion and the connection pad;
• and
• a third bent section connecting the lead portion and the lead end portion,
• wherein the connection pad is connected to the connection terminal via a joining member, and
• wherein the lead portion includes a second bent section that is protruding along a third direction intersecting the first direction and the second direction, the lead portion being substantially flat along a surface extending in the first direction between the first bent section and the second bent section.

A manufacturing method for an electronic component including a substrate that is provided with a connection terminal;

• and a lead terminal that includes a lead portion extending along a first direction, a connection pad extending along a second direction intersecting the first direction, a lead end portion extending along the second direction, a first bent section connecting the lead portion and the connection pad, and a third bent section connecting the lead portion and the lead end portion, in which the connection pad is connected to the connection terminal via a joining member, and in which the lead portion includes a second bent section that is protruding along a third direction intersecting the first direction and the second direction, the lead portion being substantially flat along a surface extending in the first direction between the first bent section and the second bent section, the manufacturing method comprising:
• connecting the connection pad of the lead terminal provided with the second bent section to the connection terminal;
• and
• forming the first bent section and the third bent section.