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US 9,412,630 B2Granted
Securing mechanism and method for wafer bonder
AssigneeSkyworks Solutions, Inc.
InventorsSteve Canale, David J. Zapp
Life of this patent
Estimating the term…
Abstract
Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.
Claims20
A method for bonding a wafer to a plate, the method comprising:
- applying an adhesive between a wafer and a plate so as to form an assembly of the wafer and the plate;
- positioning the assembly on a bonding area;
- positioning a lid over the bonding area, the lid having an outside surface and an inside surface, the inside surface configured to facilitate application of pressure to the assembly;
- applying a pushing force on the outside surface of the lid so as to secure the lid in a substantially fixed orientation, the inside surface of the lid and the bonding area forming at least part of a bonding chamber dimensioned to hold the assembly when the lid is positioned over the bonding area and secured in the substantially fixed orientation, the pushing force directed along a direction having a component that is perpendicular to a plane defined by the wafer, the pushing force applied external to the bonding chamber;
- and
- bonding the assembly by applying at least heat to the assembly.
3 more elements
A method for securing a lid of a wafer bonding device, the method comprising:
- positioning a wafer and a plate on a wafer bonding device;
- positioning a lid of the wafer bonding device over the wafer and plate in a closed position, a receiving surface that is supported by a support structure of the wafer bonding device, together with an underside of the lid, forming a bonding chamber being configured to hold the wafer and the plate when the lid is in the closed position;
- and
- while the lid is in the closed position, moving an elongate pushing member from a disengaged position in which the elongate pushing member is not in contact with the lid into an engaged position in which a pushing end of the elongate pushing member engages an upper surface of the lid externally to the bonding chamber.
1 more element
A method for bonding a wafer to a plate, the method comprising:
- positioning a lid over an assembly resting on a first surface beneath the lid, the assembly comprising a wafer and a plate, the lid having a top surface and a bottom surface, at least a portion of the bottom surface dimensioned to effect application of pressure to the wafer and the plate;
- applying a downwards pushing force to the top surface of the lid;
- and
- bonding the assembly by applying one or more of pressure and heat to the assembly.
1 more element
Dependencies are inferred from the claim text.