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US 9,412,489 B2Granted
Waterproof structure for conductive path
AssigneeYazaki Corporation
InventorsHideomi Adachi, Hidehiko Kuboshima
Life of this patent
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Abstract
A waterproof structure for a conductive path for waterproofing a conductive path without imposing an unnecessary load on a conductor, including a plurality of grooves formed on an outer circumferential surface of an insulator of a wire. The grooves 9 are formed within a predetermined range on the outer circumferential surface of the insulator and an overmold part is a seal member made of an elastomer, and is disposed and formed within the predetermined range of an electric wire to prevent water from entering the conductive path.
Claims3
A waterproof structure for a conductive path, comprising:
- a connector housing;
- an electric wire including a conductor and an insulator that covers the conductor, the electric wire being inserted from an electric-wire drawing part of the connector housing;
- and
- an overmold part formed by pouring an elastomer between the connector housing and the electric wire and provided to be watertight with respect to the electric-wire drawing part of the connector housing, wherein
- a groove is formed to be hollow by heat or cutting and provided to extend in a circumferential direction within a predetermined range on an outer circumferential surface of the insulator covering the conductor, and the overmold part is formed over the entire predetermined range such that the overmold part fills the groove,
- the groove has a semi-circular section shape, and
- the conductor is free from contacting the overmold part.
4 more elements
Dependencies are inferred from the claim text.