MEMS device with integrated temperature stabilization
AssigneeTeledyne Scientific & Imaging, LLC
InventorsJeffrey F. DeNatale, Philip A. Stupar
Life of this patent
Estimating the term…
Abstract
An apparatus for providing localized heating as well as protection for a vibrating MEMS device. A cap over a MEMS gyroscope includes an embedded temperature sensor and a heater. The temperature sensor is a trace made of a material with a known temperature/resistance coefficient, which loops back along itself to reduce electromagnetic interference. The heater is a resistive metal trace which also loops back along itself. The temperature sensor and the heater provide localized temperature stabilization for the MEMS gyroscope to reduce temperature drift in the MEMS gyroscope.
Claims19
A cap that encloses a MEMS device comprising:
- a body having an inner surface that covers the MEMS device and an outer surface that is exposed outward from the MEMS device;
- a first pad located on the outer surface;
- a second pad located on the outer surface;
- and
- a trace circuit embedded in the outer surface, the trace circuit having a first trace connected to the first pad and a second trace connected to the second pad.
A MEMS device package comprising:
- a base layer;
- a MEMS device connected to the base layer;
- a cap having an inner surface surrounding the MEMS device and an outer surface that is exposed outward from the MEMS device, the cap connected to the base layer to encapsulate the MEMS device;
- a first trench in the cap;
- a second trench in the cap;
- a first pad on the cap;
- a second pad on the cap;
- a trace circuit embedded in the outer surface, the trace circuit having a first trace located in the first trench and connected to the first pad and a second trace located in the second trench and connected to the second pad.
A MEMS device package comprising:
- a base layer;
- a MEMS device having a central stem portion connected to the base layer and one or more traces on the central stem portion of the MEMS device;
- a cap that encloses the MEMS device and connected to the base layer to encapsulate the MEMS device;
- a first pad on the central stem portion;
- a second pad on the central stem portion;
- a first trace of the one or more traces on the central stem portion of the MEMS device and connected to the first pad;
- and
- a second trace of the one or more traces on the central stem portion of the MEMS device and connected to the second pad.
Dependencies are inferred from the claim text.