Polishing composition for edge roll-off improvement
AssigneeCabot Microelectronics Corporation
InventorsHon Wu Lau, Michael White
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Abstract
The invention provides a chemical-mechanical polishing composition including (a) an abrasive comprising wet-process silica particles, (b) a water-soluble polymer, (c) an oxidizing agent, (d) a chelating agent, (e) a pH-adjusting agent, and (f) an aqueous carrier, wherein the pH of the polishing composition is about 1 to about 7. The invention also provides a method of polishing a substrate, especially a nickel-phosphorus substrate, with the polishing composition.
Claims33
A chemical-mechanical polishing composition comprising:
- (a) an abrasive comprising wet-process silica particles,
- (b) a water-soluble polymer selected from the group consisting of a polyethylene glycol homopolymer and a polyethylene glycol (PEG) and polypropylene glycol (PPG) block copolymer.
- (c) an oxidizing agent,
- (d) a cheating agent,
- (e) a pH-adjusting agent, and
- (f) an aqueous carrier,
- wherein the pH of the polishing composition is about 1 to about 7;
- wherein the abrasive further comprises alpha particles having an average particle size of about 100 nm to about 1000 nm;
- wherein the water-soluble polymer is present in the polishing composition at a concentration of about 0.0001 wt % to about 1 wt %.
The chemical-mechanical polishing composition of any 1, wherein the chelating agent comprises an amino acid or an organic carboxylic acid.
Dependencies are inferred from the claim text.