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AssigneeControl Techniques Limited
InventorsShashikant Dhondopant Patil, Vinayak Lata Kurkure, Jonathan Robert Holman-White
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There is described an electronic assembly comprising a structure and a printed circuit board (PCB) connected to the structure to form a duct. The PCB has a first side arranged to receive one or more heat-generating components, and a second side. The PCB comprises one or more apertures formed therein. The electronic assembly further comprises airflow generating means arranged to generate an airflow along the duct and along the second side of the PCB such that air is forced through the one or more apertures. By forming a duct beneath a PCB and allowing air to be forced through apertures formed in the PCB, more efficient cooling of components on the PCB may be achieved. For example, the position of the apertures may be tailored such that specific components, or specific parts of components, may be exposed to airflow through the apertures.
An electronic assembly comprising:
A method for cooling heat-generating components on a printed circuit board (PCB), comprising:
A printed circuit board (PCB) comprising on a surface thereof a component area arranged to receive a heat-generating component and one or more apertures formed therein, wherein a portion of the periphery of the PCB, adjacent the component area, is contoured inwardly towards the component area such that, when combined with a structure to form a duct, at least one of the one or more apertures for allowing airflow therethrough is formed between the structure and the periphery of the PCB.
Dependencies are inferred from the claim text.