First and second differential interconnects having interleaved stub traces

A method of making a microelectronic assembly, comprising:

• forming a first electrical connection point and a second electrical connection point;
• and
• forming a first differential interconnect coupling the first electrical connection point to the second electrical connection point, the first differential interconnect including:
• a first transmission trace including a first interior edge and a first exterior edge opposite the first interior edge;
• a second transmission trace substantially parallel with the first transmission trace and including a second interior edge and a second exterior edge opposite the second interior edge, the second interior edge facing the first interior edge;
• and
• first stub traces, respective ones of the first stub traces coupled to corresponding one of the first transmission trace and the second transmission trace and projecting from corresponding one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge, wherein a substantially equal number of stub traces project from the first exterior edge and the second exterior edge, and wherein at least twice as many stub traces project from the first and second exterior edges as project from the first and second interior edges;
• and
• forming a second differential interconnect substantially parallel, at least in part, with the first differential interconnect, wherein second stub traces of the second differential interconnect are interleaved with the first stub traces of the first differential interconnect.