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US 9,386,688 B2Granted
Integrated antenna package
AssigneeFreescale Semiconductor, Inc.
InventorsJames MacDonald, William McKinzie, III, Walter Parmon, Lawrence Rubin
Life of this patent
Estimating the term…
Abstract
An integrated antenna package includes an interposer, an integrated circuit die, and a cap that forms a cavity within the integrated antenna package. A lossy ERG structure resides at the cap overlying the integrated circuit device. A lossless EBG structure resides at the cap overlying a microstrip feedline. A radar module includes a plurality of receive portions, each receive portion including a parabolic structure having a reflective surface, an absorber structure, a lens, and an antenna.
Claims21
A packaged device comprising:
- an integrated circuit die coupled to a first side of an interposer, the integrated circuit die to receive a millimeter wavelength signal;
- a microstrip feedline on the first side of the interposer, the microstrip feedline coupled to the integrated circuit die to receive the millimeter wavelength signal;
- a ground plane on a second side of the interposer, the second side opposing the first side, the ground plane comprising a slot resonator aligned over an end portion of the microstrip feedline;
- an antenna structure attached to the second side of the interposer, a cavity formed between the antenna structure and the ground plane on the second side, the cavity aligned with the slot resonator;
- and
- a cover overlying the integrated circuit die and the microstrip feedline, an air-filled gap resides between the cover and the die and overlies the die, the cover comprising a lossy EBG structure directly overlying the integrated circuit die, and a lossless EBG structure directly overlying the microstrip feedline.
3 more elements
A method comprising:
- absorbing TE modes of a first frequency range of a first radio frequency signal, emitted from an integrated circuit die coupled to a first side of an interposer, based upon a lossy EBG structure formed in a cover overlying the integrated circuit die, wherein an air-filled gap resides between the cover and the integrated die, the lossy EBG structure including a first effective resistance between a first conductive patch and a second conductive patch, wherein the first radio frequency signal is propagating over and in a direction parallel to the integrated circuit die, a backside metal of the integrated circuit die directly underlying the first and second conductive patches;
- and
- reactively attenuating TE modes of the first frequency range of a second radio frequency signal, emitted from a slot resonator formed in a ground plane on a second side of the interposer, based upon a lossless EBG structure formed in the cover overlying the slot resonator, wherein a cavity resides between the slot resonator and an antenna structure attached to the second side of the interposer, the lossless EBG structure including a second effective resistance electrically coupling a third conductive patch to a fourth conductive patch, and the second effective resistance is at least ten times greater than the first effective resistance, and a microstrip feedline is coupled to the integrated circuit die on the first side of the interposer, the microstrip feedline located between the slot resonator and the lossless EBG structure.
A packaged device comprising:
- an integrated circuit die coupled to a first side of an interposer, the integrated circuit die to provide a millimeter wavelength signal;
- the interposer comprising a microstrip feedline on the first side of the interposer, the microstrip feedline coupled to the integrated circuit die to receive the millimeter wavelength signal;
- the interposer further comprising a ground plane on a second side of the interposer, the second side opposing the first side, the ground plane comprising a slot resonator aligned over an end portion of the microstrip feedline;
- an antenna structure attached to the second side of the interposer, a cavity formed between the antenna structure and the ground plane on the second side, the cavity aligned with the slot resonator;
- and
- a cover overlying the integrated circuit die and the microstrip feedline, an air-filled gap resides between the cover and the die and overlies the die, the cover comprising:
- a first metamaterial structure at a first location to absorb power in a TE mode of a package including the integrated circuit die, the interposer and the cover, the integrated circuit die between the interposer and the first location;
- and a second metamaterial structure at a second location to not absorb power in the TE mode of the package, the microstrip feedline between the slot resonator and second location.
5 more elements
Dependencies are inferred from the claim text.