Method and apparatus for selective deposition
AssigneeApplied Materials, Inc.
InventorsEllie Y. Yieh, Srinivas D. Nemani, Ludovic Godet, Yin Fan, Tristan Ma
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AssigneeApplied Materials, Inc.
InventorsEllie Y. Yieh, Srinivas D. Nemani, Ludovic Godet, Yin Fan, Tristan Ma
Estimating the term…
Methods for forming fin structures with desired materials formed on different locations of the fin structure using a selective deposition process for fin field effect transistors (FinFETs) are provided. In one embodiment, a method of forming a structure with desired materials on a substrate includes depositing a first material on a substrate having a three-dimensional (3D) structure formed thereon while performing an implantation process to dope a first region of the 3D structure. The first material may be removed and a second material may be deposited on the 3D structure. The second material may selectively grow on a second region of the 3D structure.
A method of forming a structure on a substrate, comprising:
A method of forming a fin structure on a substrate, comprising:
A method of forming a fin structure on a substrate, comprising:
Dependencies are inferred from the claim text.