Use of RFID chip as assembly facilitator

An RFID assembly comprising:

• an RFID chip with a member having an electrical characteristic that imparts heat by electrical action internal of the RFID chip wherein the member comprises at least one chip diode;
• at least one other RFID component assembled with the RFID chip by a cured adhesive joint;
• an external energy source focused on the RFID chip;
• and
• the cured adhesive joint had been formed from an uncured adhesive in contact with the RFID chip and the other RFID component, the uncured adhesive having been cured with heat from the RFID chip by action of the member having an electrical characteristic to generate electrical current.

A method of assembling RFID components together, comprising:

• providing an RFID chip associated with a member having a chip diode built into the RFID chip and an electrical characteristic that internally heats the RFID chip by electrical action of that member;
• providing the RFID chip with an inbuilt temperature sensor;
• providing at least one other RFID component adapted to be assembled with the RFID chip;
• positioning an uncured adhesive into contact with the RFID chip and with the other RFID component;
• heating the RFID chip by action of the member having an electrical characteristic to generate electrical current and monitoring the temperature of the RFID chip for reaching of a threshold temperature needed for adequate heating the uncured adhesive into a cured adhesive joint,
• focusing an external source of energy onto the RFID chip and ceasing this focusing when the threshold temperature is achieved;
• and
• whereby the RFID chip and the other RFID component are assembled together by the cured adhesive joint.