Devices and methods for high-resolution image and video capture

An imaging system comprising:

• a primary image sensor array;
• a primary optical system configured to project a primary image on the primary image sensor array, the primary optical system having a first zoom level;
• a plurality of secondary image sensor arrays, the primary image sensor array and the plurality of secondary image sensor arrays being fabricated on a single integrated circuit, the primary image sensor array employing pixels of a first linear dimension and the plurality of secondary image sensor arrays each employing pixels of a second linear dimension, a ratio of the first linear dimension and the second linear dimension being greater than 1.3 to 1;
• a secondary optical system for each of the secondary image sensor arrays, each of the secondary optical systems being configured to project a secondary image on a respective one of the secondary image sensor arrays, each of the secondary optical systems having a respective zoom level different than the first zoom level, each of the secondary image sensor arrays and each of the secondary optical systems are pointed in the same direction as the primary image sensor array and the primary optical system, the primary image sensor array being larger than each of the secondary image sensor arrays;
• first pixel circuitry configured to read image data from the primary image sensor array;
• second pixel circuitry configured to read image data from the plurality of secondary image sensor arrays;
• an electronic global shutter configured to stop charge integration between the primary image sensor array and the first pixel circuitry and between a selected one or more of the plurality of secondary image sensor arrays and the second pixel circuitry at substantially the same time;
• and
• a photosensitive layer formed over a substrate with at least one of the first pixel circuitry and the second pixel circuitry being fabricated below at least a portion of the photosensitive layer.

An imaging system comprising:

• a semiconductor substrate;
• a plurality of image sensor arrays, including a primary image sensor array and a plurality of secondary image sensor arrays, the primary image sensor array and the plurality of secondary image sensor arrays being fabricated on a single integrated circuit, the primary image sensor array employing pixels of a first linear dimension and the plurality of secondary image sensor arrays employing pixels of a second linear dimension, a ratio of the first linear dimension and the second linear dimension being greater than 1.3 to 1;
• a plurality of optical systems, including at least one optical system for each image sensor array, each of the optical systems having a different zoom level, each of the image sensor arrays including pixel circuitry formed on the semiconductor substrate, the pixel circuitry being configured to read an image signal from the respective image sensor array, the pixel circuitry for each of the image sensor arrays including switching circuitry;
• a control circuit operatively coupled to the switching circuitry of each of the image sensor arrays;
• first pixel circuitry configured to read image data from the primary image sensor array;
• second pixel circuitry configured to read image data from the plurality of secondary image sensor arrays;
• an electronic global shutter configured to stop charge integration between the primary image sensor array and the first pixel circuitry and between a selected one or more of the plurality of secondary image sensor arrays and the second pixel circuitry at substantially the same time;
• and
• a photosensitive layer formed over the semiconductor substrate with at least one of the first pixel circuitry and the second pixel circuitry being fabricated below at least a portion of the photosensitive layer.