Electronic device and heat dissipation method

An electronic device, comprising:

• a main body, having an iru1er space;
• a supporting layer, disposed on the main body and covering the inner space,
• wherein the supporting layer has at least one first opening;
• and
• at least one press element, disposed on the supporting layer and having a chamber and at least one second opening, wherein the first opening and the second opening are connected to the chamber, and the second opening is exposed outside the main body,
• in response to the press element being pressed and elastically deformed, air inside the chamber flows to the inner space through the first opening, and in response to the press element being stopped being pressed and restored, air outside the chamber flows to inside the chamber through the second opening,
• wherein the press element comprises an elastic portion and a press portion, the elastic portion is disposed on the supporting layer, the chamber and the second opening are formed on the elastic portion, the press portion is connected to the elastic portion and adapted to be pressed so that the elastic portion is elastically deformed,
• wherein in response to the press portion being pressed so that the elastic portion is elastically deformed, the press portion covers the second opening.