Loading patent…
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorsYoshiyuki Nakai, Tsuyoshi Kimura, Atsushi Kazuno, Kazuyuki Ogawa, Tetsuo Shimomura
Estimating the term…
A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (a), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (a) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.
A polishing pad, comprising a polishing layer comprising a polyurethane foam having fine cells,
Dependencies are inferred from the claim text.