(Meth)acrylate composition
AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd., Kyushu University
InventorsTatsuya Hase, Kazuo Nakashima, Makoto Mizoguchi
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Abstract
Presented is a (meth)acrylate composition that can be cured even in an unirradiated portion that is not reached by light. The (meth)acrylate composition contains a compound having one or more vinyl groups in a molecular structure thereof. The compound has a ratio of a molecular weight thereof to a number of the vinyl groups of 300 or lower. The composition generates a heat of reaction during photopolymerization thereof, and the heat of reaction causes thermal polymerization of the composition.
Claims3
A method for curing a (meth)acrylate composition, the composition comprising a first compound having one or more vinyl groups in a molecular structure thereof, the compound having a ratio of a molecular weight thereof to a number of the vinyl groups of 300 or lower, the composition not comprising a thermal polymerization initiator or a chain transfer agent, the method comprising a step of curing the composition without agitating the composition, wherein a portion of the composition that is not irradiated with light reaches a temperature from 151 to 175° C. as a result of photopolymerization of the composition and is cured by thermal polymerization caused by a heat of reaction generated during said photopolymerization.
Dependencies are inferred from the claim text.