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US 9,352,071 B2Granted
Method of forming an implantable device
AssigneeEthicon, Inc.
InventorsSusanne Landgrebe, Daniel Smith, Oliver Dick
Life of this patent
Estimating the term…
Abstract
An implantable structure, method for making the structure and method for using the structure, where the structure includes a combination of non-absorbable and absorbable components, and the implantable structure has a randomly uniform array of materials. The resulting implantable structure provides improved tissue ingrowth and flexibility after implantation and after absorption of the absorbable materials.
Claims10
A method of forming an implantable device, comprising the steps of:
- a. Forming a first yarn and a second yarn, wherein at least one of said first yarn and second yarns includes a first non-absorbable filament and at least one of said first yarn and second yarns includes a first absorbable filament, said first absorbable filament having a lower melting point than said first non-absorbable filament, and including the step of kinking at least one of said first absorbable filament and said first non-absorbable filament prior to forming said first or second yarn;
- b. Forming an initial woven structure comprising said first yarn and second yarn;
- c. Subjecting said initial woven structure to a first heat treatment at a first temperature sufficient to cause shrinkage of said first absorbable filament, and thus buckling at least the second yarn and forming an initial heated structure;
- d. Heating said initial heated structure to a second temperature, said second temperature being higher than said first temperature, wherein at least a portion of said first absorbable filament is melted;
- and
- e. Allowing said heated structure to cool to form a resulting implantable device.
3 more elements
Dependencies are inferred from the claim text.