Method for producing microcarriers
AssigneeMycartis NV
InventorsRaphael Tornay, Nicolas Demierre, Stephan Gamper, Philippe Renaud
Life of this patent
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Abstract
The present invention relates to a method for producing microcarriers comprising the following steps: (a) providing a wafer having a sandwich structure comprising a bottom layer, a top layer and an insulating layer located between said bottom and top layers, (b) etching away the top layer to delineate lateral walls of bodies of the microcarriers, (c) depositing a first active layer at least on a top surface of the bodies, (d) applying a continuous polymer layer over the first active layer, (e) etching away the bottom layer and the insulating layer, (f) removing the polymer layer to release the microcarriers.
Claims20
A method for producing microcarriers comprising the following steps:
- (a) providing a wafer having a sandwich structure comprising a bottom layer, a top layer and an insulating layer located between said bottom and top layers,
- (b) etching away the top layer to delineate lateral walls of bodies of the microcarriers,
- (c) depositing a first layer at least on a top surface of the bodies,
- (d) applying a continuous polymer layer over the first layer,
- (e) etching away the bottom layer and the insulating layer, and
- (f) removing the polymer layer to release the microcarriers.
Dependencies are inferred from the claim text.