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US 9,338,915 B1Granted
Method of attaching electronic module on fabrics by stitching plated through holes
AssigneeFlextronics AP, LLC
InventorsWeifeng Liu, Anwar Mohammed, Zhen Feng
Life of this patent
Estimating the term…
Abstract
A wearable electronics assembly includes one or more electronic modules coupled to a wearable electronics fabric. Each of the one or more electronic modules includes one or more plated through holes, through each of which is coupled an electrically conductive wire. The electrically conductive wire is stitched through the plated through hole and to a fabric onto which the electronic module is attached. The electronic module can include one or more electronic components coupled to a printed circuit board.
Claims12
An electronics assembly comprising:
- a fabric;
- an electronics module coupled to the fabric, wherein the electronics module includes a printed circuit board comprising a laminate substrate, a plated through hole formed through the laminate substrate, an electrically conductive interconnect electrically coupled to the plated through hole and an electronic component electrically coupled to the electrically conductive interconnect, further wherein the plated through hole forms an electrical connection point on the laminate substrate;
- and
- an electrically conductive wire passing through the plated through hole and stitched to the fabric such that an electrical connection is formed between the electrically conductive wire and the electrical connection point.
1 more element
Dependencies are inferred from the claim text.