Method for producing conductive tracks

A method for producing conducting tracks, comprising the steps of:

• applying continuous metallization layers onto a non-conductive substrate;
• forming a metallization pattern comprising tracks and conductive tracks;
• and
• applying a protective barrier layer onto the formed tracks and applying an attachment layer for attaching element parts onto the formed conductive tracks, said element parts being one of a group consisting of soldered, welded, or both by said attachment layer,
• wherein the step of applying continuous metallization layers comprises:
• successively applying an adhesion sub-layer, a conductive layer and a metal layer serving as a mask onto the non-conductive substrate, and
• wherein the step of forming the metallization pattern, comprises:
• forming the mask by laser ablation on regions of the metal layer, said metal layer serving as the mask and said regions not occupied by the conductive tracks;
• removing the conductive layer and the adhesion sub-layer in opened regions by selective chemical etching;
• removing the mask by selective chemical etching;
• and then
• applying the protective barrier layer and the attachment layer.