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US 9,332,642 B2Granted
Circuit board
AssigneePanasonic Corporation
InventorsShingo Yoshioka, Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda
Life of this patent
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Abstract
One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.
Claims3
A circuit board comprising:
- an insulating base substrate;
- and
- a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein
- the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less,
- the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate,
- the depth of the wiring groove is at least partially 3 to 15 μm,
- a thickness of the circuit layer is 0.1 to 10 μm, and
- an aspect ratio between the width of the wiring groove and the depth of the wiring groove is such that the depth of the wiring groove/the width of the wiring groove is 1.0 or less.
5 more elements
Dependencies are inferred from the claim text.