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US 9,326,408 B2Granted
Sensor having a sensor housing
AssigneeRobert Bosch GmbH
InventorsHolger Scholzen, Christoph Gmelin, Jens Vollert, Markus Ellmer
Life of this patent
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Abstract
A sensor has a sensor housing, an electronic component, and a sensor element. The electronic component and the sensor element are connected to one another in a media-tight manner. An adhesive which provides a seal is placed between bonding sites of a bonding wire of the at least one electrical connection.
Claims8
A sensor, comprising:
- a sensor housing;
- an electronic component;
- and
- a sensor element, wherein the electronic component and the sensor element are electrically connected to one another in a media-tight manner via an electrically-conductive plating and first and second bonding wires, the plating including first and second bonding sites, the first bonding wire connecting the first bonding site to the sensor element, the second bonding wire connecting the second bonding site to the electronic component, wherein an adhesive which provides a seal is placed between the first and second bonding sites and between the first and second bonding wires, and wherein the adhesive is placed on the plating, and wherein a gel is applied on a media side of a base plate, the gel at least partially covering the first bonding sites and the first bonding wires.
1 more element
A sensor, comprising:
- a sensor housing;
- an electronic component and
- a sensor element, wherein the electronic component and the sensor element are electrically connected to one another in a media-tight manner via an electrically-conductive plating and first and second bonding wires, the plating including first and second bonding sites, the first bonding wire connecting the first bonding site to the sensor element, the second bonding wire connecting the second bonding site to the electronic component, wherein an adhesive which provides a seal is placed between the first and second bonding sites and between the first and second bonding wires, and wherein the adhesive is placed on the plating, wherein the plating is (i) implemented with molded-interconnect-device technology and (ii) embedded in a base plate of the sensor housing, and wherein:
- the plating is used as a printed conductor;
- free spaces are formed next to the plating;
- and
- the free spaces are filled by a filler material with the aid of the adhesive.
4 more elements
Dependencies are inferred from the claim text.