Wiring board and method of manufacturing the same
AssigneeKYOCERA Circuit Solutions, Inc.
InventorMitsuzo Yokoyama
Life of this patent
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Abstract
Provided is a wiring board including: an insulating board having a mounting portion configured such that a semiconductor element is mounted on an upper surface thereof; a semiconductor element connection pad formed on the mounting portion; a conductor pillar formed on the semiconductor element connection pad; and a solder resist layer adhered on the insulating board. The solder resist layer has a first region with a thickness such that the semiconductor element connection pad and a lower end portion of the conductor pillar are embedded while an upper end portion of the conductor pillar protrudes, and a second region having a thickness larger than that of the first region and surrounding the first region.
Claims4
A wiring board comprising:
- an insulating board having a mounting portion configured such that a semiconductor element is mounted on an upper surface thereof;
- a semiconductor element connection pad formed on the mounting portion;
- a conductor pillar formed on the semiconductor element connection pad;
- and a solder resist layer adhered on the insulating board, wherein the solder resist layer has a first region with a thickness such that the semiconductor element connection pad and a lower end portion of the conductor pillar are embedded while an upper end portion of the conductor pillar protrudes, and a second region having a thickness larger than that of the first region and surrounding the first region, wherein the semiconductor element is placed on top of the conductor pillar to be connected therewith, and a gap between the semiconductor element and the solder resist layer in the first region is filled with an under fill.
Dependencies are inferred from the claim text.