Back to results
US 9,326,386 B2Granted
Computer system component bay
AssigneeInternational Business Machines Corporation
InventorsBret P. Elison, Phillip V. Mann, Arden L. Moore, Arvind K. Sinha
Life of this patent
Estimating the term…
Abstract
An apparatus includes a component bay having an operational height and an expanded height. The component bay is moveable between the operational height and the expanded height. A thermal element divides the component bay into one or more compartments, each compartment configured to receive a system component. The component bay at the operational height provides thermal contact between the received system component and the thermal element.
Claims17
An apparatus for containing computer system components, the apparatus comprising:
- a component bay having an operational height and an expanded height, the component bay moveable between the operational height and the expanded height;
- a thermal element dividing the component bay into two compartments, each of the two compartments configured to receive a system component, wherein the component bay at the operational height provides thermal contact between the received system components and the thermal element;
- wherein the component bay contains scissor structures on opposing sides of the component bay, the scissor structures providing movement of the component bay between the operational height and the expanded height,
- a frame module supporting the component bay;
- and
- a frame unit configured to support the frame module, wherein the frame module configured to move between a first position and a second position, the first position within the frame unit, the second position at least partially removed from the frame unit.
3 more elements
An apparatus for containing computer system components, the apparatus comprising:
- a frame module;
- a plurality of component bays supported by the frame module, the plurality of component bays having an operational height and an expanded height, the plurality of component bays moveable between the operational height and the expanded height;
- a conduction plate dividing each component bay into two compartments, each of the two compartments configured to receive a system component, wherein the component bay at the operational height provides thermal contact between the received system components and the conduction plate;
- a heat dissipation region thermally connected to each conduction plate;
- wherein each component bay contains scissor structures on opposing sides of the component bay, the scissor structures providing movement of the component bay between the operational height and the expanded height,
- a frame unit supporting the frame module, wherein the frame module is configured to move between a first position and a second position, the first position within the frame unit, the second position at least partially removed from the frame unit.
3 more elements
An apparatus for containing computer system components, the apparatus comprising:
- a first component bay having an operational height and an expanded height;
- a pair of scissor structures on opposing sides of the first component bay, the pair of scissor structures configured to provide movement of the first component bay between the operational height and the expanded height, each of the pair of scissor structures on opposing sides of the first component bay;
- a conduction plate extending horizontally through the first component bay and dividing the first component bay into two compartments;
- a u-shaped guide track within each of the two compartments, each of the u-shaped guide tracks configured to receive a hard disk drive;
- a thermal pad mounted on each of a top face and bottom face of the conduction plate, wherein the first component bay at the operational height provides thermal contact between the received hard disk drives and the thermal element through contact with the thermal pads compressed between the received hard disk drives and the thermal element, the received hard disk drives on opposing sides of the thermal element;
- a backplane associated with each of the two compartments, each backplane configured to electronically connect to received hard disk drives;
- a frame module supporting the first component bay and a plurality of other component bays, the first component bay and the plurality of other component bays arranged in two rows to create a central airflow channel, heat dissipation regions from the first component bay and the plurality of other component bays bounding the central airflow channel;
- a frame unit configured to support the frame module, wherein the frame module configured to move between a first position and a second position, the first position within the frame unit, the second position at least partially removed from the frame unit;
- a printed circuit board associated with the frame module;
- and
- a cable electronically connecting each backplane to the printed circuit board.
8 more elements
Dependencies are inferred from the claim text.