LED package manufacturing system and resin coating method in LED package manufacturing system
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorMasaru Nonomura
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AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorMasaru Nonomura
Estimating the term…
In resin coating used for manufacturing the LED package in which the LED elements is covered with a resin containing a phosphor, a translucent member 43 coated with a resin 8 on trial as light emitting characteristic measurement is mounted on a translucent member mounting unit 41 having a light source unit, and an excitation light emitted from the light source unit is irradiated onto the resin 8 coated on the translucent member 43, and a deviation between a measurement result obtained by measuring the light emitting characteristics of a light emitted by the resin 8 by a light emitting characteristic measurement unit 39 and light emitting characteristics specified in advance is obtained, and an appropriate resin coating amount of the resin to be coated on the LED elements as real production is calculated on the basis of the deviation.
An LED package manufacturing system that manufactures an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor therein, the LED package manufacturing system comprising:
A resin coating method in an LED package manufacturing system that manufactures an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor therein, in which the resin is coated on a plurality of LED elements mounted on the substrate by the component mounting device, the LED package manufacturing system including:
Dependencies are inferred from the claim text.