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US 9,326,383 B2Granted
Heat spreader with high heat flux and high thermal conductivity
AssigneeTeledyne Scientific & Imaging, LLC
InventorsSteve Qingjun Cai, Chung-Lung Chen, Chialun Tsai
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Abstract
A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.
Claims10
A method for assembling a heat spreader system, comprising:
- providing a plurality of bottom microporous wicks recessed in a bottom substrate;
- bonding a center substrate to said bottom substrate;
- bonding a top substrate having a top chamber portion to said center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks;
- etching a bottom substrate side port along one side of said bottom substrate;
- etching a top substrate side port along one side of said top substrate;
- providing a center substrate side port in said center substrate;
- and
- aligning said bottom substrate side port, top substrate side port and center substrate side port to one another prior to said bonding said center substrate and said bonding said top subtrate.
5 more elements
The method of 1, further comprising:
- etching at least one center substrate post in said center substrate, said center substrate post extending from an interior portion of said center substrate to a first surface of said center substrate;
- etching a channel around a perimeter of said center substrate into said first surface to establish a first center substrate bonding surface extending around the perimeter of said center substrate;
- bonding said at least one center substrate post to said at least one bottom substrate pillar;
- bonding said bottom substrate to said center substrate bonding surface;
- etching through a second surface of said center wafer to free said at least one center substrate post and said center substrate bonding surface from a remainder of said center substrate;
- and
- removing said remainder of said center wafer from the heat spreader;
- wherein said bottom wafer is coupled to a center substrate bonding surface extending around a perimeter of said center substrate and said at least bottom pillar is coupled to said at least one center substrate post.
5 more elements
Dependencies are inferred from the claim text.