Multilayer ceramic capacitor and board having the same mounted thereon

A board having a multilayer ceramic capacitor mounted thereon, the board comprising:

• a printed circuit board having two or more electrode pads formed thereon;
• the multilayer ceramic capacitor mounted on the printed circuit board;
• and
• a solder connecting the electrode pads and the multilayer ceramic capacitor,
• wherein the multilayer ceramic capacitor includes:
• ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other;
• an active layer including a plurality of first and second internal electrodes disposed to face each other with at least one of the dielectric layers interposed therebetween and alternately exposed to the first or second side surface;
• upper and lower cover layers disposed on and below the active layer, respectively;
• and
• a first external electrode disposed on the first side surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode disposed on the second side surface and electrically connected to the second internal electrode,
• when a thickness of the ceramic body is defined as T and a width thereof is defined as W, 0.75W≦T≦1.25W is satisfied,
• when a gap between the first and second external electrodes is defined as G, 30 μm≦G≦0.9W is satisfied, and
• an average number of dielectric grains in a single dielectric layer in a thickness direction thereof is 2 or greater.