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US 9,326,380 B2Granted
Universal serial bus hybrid footprint design
AssigneeIntel Corporation
InventorsKuan-Yu Chen, Howard L. Heck
Life of this patent
Estimating the term…
Abstract
A universal serial bus hybrid footprint design is described herein. The design includes an outer row of one or more surface mount technology (SMT) contacts and an inner row of one or more printed through holes (PTH). The hybrid footprint design enables a data through put of at least 10 Gbps.
Claims20
An apparatus, comprising:
- an outer row of one or more surface mount technology (SMT) contacts;
- and
- an inner row of one or more printed through holes (PTH), wherein at least one via stub is removed and at least one printed through hole is a press fit contact.
A hybrid USB footprint within a USB connection, comprising:
- an outer row of one or more surface mount technology (SMT) contacts;
- and
- an inner row of one or more printed through holes (PTH), wherein at least one via stub is removed and at least one printed through hole is a press fit contact.
A method for providing a hybrid USB footprint within a USB connection, comprising:
- generating an outer row of one or more surface mount technology (SMT) contacts;
- generating an inner row of one or more printed through holes (PTH), wherein at least one printed through hole is a press fit contact;
- and
- removing at least one via stub from the one or more printed though holes.
1 more element
Dependencies are inferred from the claim text.