Thin-film wiring substrate and substrate for probe card

A thin-film wiring substrate comprising:

• a base that includes a ceramic substrate having an upper surface and a wiring conductor provided on the upper surface of the ceramic substrate;
• a bonding layer laminated on the upper surface of the ceramic substrate;
• a thin-film wiring layer laminated on a top surface of the bonding layer;
• and a through conductor that passes through the bonding layer in a thickness direction and electrically connects the wiring conductor to the thin-film wiring layer,
• wherein the bonding layer includes a core layer composed of a thermosetting resin, and
• adhesive layers comprising a first adhesive layer laminated on an upper surface of the core layer and in contact with the thin-film wiring layer and a second adhesive layer laminated on a lower surface of the core layer and in contact with the upper surface of the ceramic substrate,
• the adhesive layers being composed of a thermosetting resin having an elastic modulus range of about 100 MPa to about 1500 MPa and the thermosetting resin constituting the core layer having an elastic modulus range of about 2000 MPa to about 10000 MPa, and
• the first adhesive layer laminated on the upper surface of the core layer has an elastic modulus larger than that of the second adhesive layer laminated on the lower surface of the core layer.