Printed wiring board

A printed wiring board comprising:

• an inner layer structure body containing at least an inner layer insulative base material composed of a glass cloth and resin which covers the glass cloth and not containing a resin insulative base material composed only of resin;
• outer layer wiring formed on a first face of the inner layer structure body;
• and
• a solder resist layer formed on a surface of the outer layer wiring,
• wherein, in the inner layer structure body, an opening part which extends from a second face positioned opposite to the first face toward an inside and does not reach the first face is formed,
• the solder resist layer is composed of a first ink part covering at least the outer layer wiring that is formed on a partial region of the first face which corresponds to the opening part and a second ink part interposing both ends of the first ink part and being lower in flexibility than the first ink part,
• the first ink part contains at least acrylate resin, epoxy resin and filler,
• the second ink part contains at least acrylate resin, acrylic monomer, epoxy resin and filler,
• the first ink part is lower in content ratio of the acrylic monomer than the second ink part.