Modular liquid-cooled power semiconductor module, and arrangement therewith

A power semiconductor module, having a basic parallelepipedal shape, the module comprising:

• two opposed main sides, two opposed longitudinal sides and two opposed narrow sides;
• a cooling device which is capable of carrying a flow of a cooling fluid;
• a power electronics switch;
• and
• a housing;
• wherein said cooling device includes a cooling volume having at least one cooling face and at least four connection devices for the cooling liquid, said at least four connection devices being arranged in pairs on said opposed main sides;
• wherein said connection devices include a flow inflow, a flow outflow, a return inflow and a return outflow;
• wherein said power electronics switch includes load connection devices which are respectively arranged on at least one of said longitudinal sides and also a control connection device which is arranged on a narrow side of the power semiconductor module;
• and
• wherein said housing covers a power electronics circuit of said power electronics switch and has recesses for said load and control connection devices;
• wherein said cooling device includes at least two opposed cooling faces;
• wherein said power electronics circuit includes at least two switching modules;
• and
• wherein two of said at least two switching modules are arranged on respective ones of said at least two opposed cooling faces of said cooling device.