Communication module-cooling structure and communication device

A communication module-cooling structure, comprising:

• a heat sink including a pair of cooling receiving portions each comprising partition walls and slit-shaped receiving spaces defined by the partition walls, and a plate-shaped body to couple the pair of cooling receiving portions together, the cooling receiving portions and the body being formed integrally with each other;
• and
• a cooling mechanism to cool the body,
• wherein the receiving spaces of the cooling receiving portions receive communication modules respectively, the communication modules each including a respective substrate mounted with a respective communication circuit component thereon and respective one pair of sidewalls with the respective substrate located therebetween in a thickness direction of the respective substrate,
• wherein the receiving spaces of the cooling receiving portions each include an inner surface, and respective at least one sidewalls of the respective one pairs of sidewalls of the communication modules are in surface contact with the inner surfaces of the receiving spaces, respectively,
• wherein the heat sink includes a heat absorbing surface to absorb heat from a processor being external to the communication modules and being electrically connected to the communication modules,
• wherein the communication module-cooling structure further comprises:
• a mother board to which the heat sink is fixed;
• and
• connectors to which the communication modules are mated, respectively,
• wherein the connectors are mounted on the mother board, and each of the receiving spaces is open in both directions at right angles to the mother board, and in one direction parallel to the mother board.

A communication module-cooling structure, comprising:

• a heat sink including a pair of cooling receiving portions each comprising partition walls and slit-shaped receiving spaces defined by the partition walls, and a plate-shaped body to couple the pair of cooling receiving portions together, the cooling receiving portions and the body being formed integrally with each other;
• and
• a cooling mechanism to cool the body,
• wherein the receiving spaces of the cooling receiving portions receive communication modules respectively, the communication modules each including a respective substrate mounted with a respective communication circuit component thereon and respective one pair of sidewalls with the respective substrate located therebetween in a thickness direction of the respective substrate,
• wherein the receiving spaces of the cooling receiving portions each include an inner surface, and respective at least one sidewalls of the respective one pairs of sidewalls of the communication modules are in surface contact with the inner surfaces of the receiving spaces, respectively,
• wherein the heat sink includes a heat absorbing surface to absorb heat from a processor being external to the communication modules and being electrically connected to the communication modules,
• wherein the communication circuit components each include a respective optical element which is optically coupled to an optical fiber, and a respective semiconductor circuit element which is electrically connected to the respective optical element,
• wherein of the respective one pairs of sidewalls of the communication modules, at least respective one sidewalls whose temperature rise resulting from heat evolution in the optical elements and the semiconductor circuit elements is large are in surface contact with the inner surfaces of the receiving spaces, respectively.

A communication device, comprising:

• a heat sink including a pair of cooling receiving portions each comprising partition walls and slit-shaped receiving spaces defined by the partition walls, and a plate-shaped body to couple the pair of cooling receiving portions together, the cooling receiving portions and the body being formed integrally with each other;
• a cooling mechanism to cool the body;
• and
• communication modules, each of which includes a respective substrate mounted with a respective communication circuit component thereon and respective one pair of sidewalls with the respective substrate located therebetween in a thickness direction of the respective substrate,
• wherein the receiving spaces of the cooling receiving portions receive the communication modules respectively, and each include an inner surface, and respective at least one sidewalls of the respective one pairs of sidewalls of the communication modules are in surface contact with the inner surfaces of the receiving spaces, respectively,
• wherein the heat sink includes a heat absorbing surface to absorb heat from a processor being external to the communication modules and being electrically connected to the communication modules.