Bumpless build-up layer package including a release layer

An apparatus, comprising:

• a first substrate;
• a release layer coupled with the first substrate above the first substrate;
• a resin layer coupled with the release layer above the release layer;
• a metal film coupled with the resin layer, above the resin layer at a bottom surface of the metal film, the metal film including a cavity therein, the cavity extending from a top surface of the metal film through the bottom surface of the metal film to the resin layer;
• a microelectronic die coupled with the metal film in the cavity;
• and
• a first bumpless buildup layer substrate coupled with an active surface of the die above the die
• wherein the first substrate includes a first substrate cavity extending from a top surface of the first substrate and into the first substrate, the release layer is situated in the first substrate cavity, and the resin layer is situated in the first substrate cavity, and
• wherein a top surface of the first resin layer is generally co-planar with a top surface of the first substrate.