Method of forming a semiconductor socket

A method of forming a semiconductor socket comprising the steps of:

• providing a substrate with a plurality of through holes extending from a first surface to a second surface, the substrate having a plurality of recesses formed in the second surface that overlap with the through holes;
• preparing separate from the substrate a plurality of discrete contact members comprising distal portions with cantilever beams and proximal portions configured to reside in the recesses formed in the second surface of the substrate;
• mechanically inserting the distal portions of the discrete contact members in a plurality of the recesses so that, the cantilever beams extend into the through holes and are located above the first surface of the substrate a sufficient amount to permit flexure when coupled with terminal on semiconductor devices, and the, proximal ends positioned in the recesses and accessible from the second surface;
• depositing at least one dielectric layer selectively on the second surface of the substrate to create trace recesses corresponding to a target circuit geometry;
• depositing a conductive material in a plurality of the trace recesses to form conductive traces redistributing terminal pitch of the proximal ends of the contact members;
• compressively engaging terminals on a first semiconductor device with the distal ends of the contact members to flex the cantilever beams toward the first surface of the substrate;
• attaching a solder ball to the conductive traces at a location offset from the proximal ends of the contact members;
• and
• electrically coupling the solder balls with terminals on a circuit member, wherein the circuit member is selected from one of a printed circuit board, a flexible circuit, a bare die device, an integrated circuit device, organic or inorganic substrates, or a rigid circuit.