Touch member and method of manufacturing the same

A method of manufacturing wiring board comprising:

• forming at least one through-via passing through an initial substrate from a first surface of the substrate to an opposing second surface of the substrate, wherein the through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a cylindrical tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion, wherein the first depressed portion and the second depressed portion are non-coaxial, the first and second depressed portions being formed with corresponding first and second bore axes slanting toward each other at an angle in a range of 5 to 70 degrees, the bore axis of the second depressed portion is substantially perpendicular to the second surface of the substrate, and an internal diameter of the tunnel portion is of substantially constant diameter and less than a diameter of the first depressed portion in the first surface and a diameter of the second depressed portion in the second surface, the first depressed portion being formed with a first opening in the first surface, the second depressed portion being formed with a second opening in the second surface, wherein a vertical projection of a center point of the first opening on the second surface and a center point of the second opening are offset from each other by a distance in a range of 5 micrometer to 40 micrometers;
• forming a first conductor layer on the first surface;
• forming a second conductor layer on the second surface;
• and
• forming a through-via conductor in the through-via for electrically connecting to the first conductor layer and the second conductor layer.