Electrical interconnect IC device socket

A surface mount electrical interconnect to provide an interface between a PCB and solder balls on a BGA device, the electrical interconnect comprising:

• a socket substrate comprising a first layer having a plurality of openings configured to receive the solder balls on the BGA device and a second layer having a plurality of slots defined therethrough that correspond to the plurality of openings;
• a plurality of electrically conductive contact members disposed in the openings in the first layer and through the plurality of slots of the second layer of the socket substrate, each contact member comprising at least three interlocking contact plates that engage with each other in a single opening in the socket substrate and include a semicircular notch with a diameter corresponding to a diameter of the solder ball that simultaneously engages at least a center diameter and a lower portion of the solder balls at a solder ball interface region such that a solder ball positioned in the opening is nested within the contact member and removable from the contact member and the opening without reflow, and wherein the contact member is configured to electrically couple the solder ball on the BGA device to the PCB.

A method of making a surface mount electrical interconnect to provide an interface between a PCB and solder balls on a BGA device, the method comprising:

• forming a socket substrate with a first layer having a plurality of openings configured to receive the solder balls on the BGA device and a second layer having a plurality of slots defined therethrough that correspond to the plurality of openings;
• inserting a plurality of electrically conductive contact members within the openings in the first layer and through the plurality of slots of the second layer of the socket substrate, each contact member comprises at least three interlocking contact plates that engage with each other in a single opening in the socket substrate and including a semicircular notch with a diameter corresponding to a diameter of the solder balls that simultaneously engages at least a center diameter and a lower portion of the solder balls, the notch configured to receive and retain a portion of a solder ball of the BOA device such that a solder ball positioned in the opening is nested within the contact member and removable from the contact member and the opening without reflow, and wherein the contact member is configured to electrically couple the solder ball on the BOA device to the PCB.