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US 9,320,131 B2Granted
Power supply device and components thereof
AssigneeIntervention Technology, Pty, Ltd
InventorDonald Victor Williams
Life of this patent
Estimating the term…
Abstract
A power supply device includes a capacitance partition, a control partition, a power switching partition, a thermal conduction partition, and a magnetic partition. The thermal conduction partition includes electrical connections to connect other partitions. The thermal conduction partition provides for magnetic shielding of the magnetic partition and thermal dissipation in a substantially orthogonal direction to the electrical connections. The layering arrangement allows automated production and/or testing.
Claims20
A thermal/electrical connector comprising
- a thermally conductive layer with integral electrical pins, wherein the thermally conductive layer is disposed between two layers of electronic components, and wherein the integral electrical pins are configured to provide electrical connections between electronic components on each side of the thermally conductive layer;
- wherein the thermally conductive layer is in thermal contact with heat-generating components in at least one of the layers of electronic components,
- wherein the thermally conductive layer is configured to conduct heat from the heat-generating components to edges of the thermally conductive layer, and
- wherein substantially all of the heat from the heat-generating components is dissipated through the edges of the thermally conductive layer.
1 more element
A method of manufacturing a power supply comprising:
- providing a thermal conduction partition comprising a thermally conductive layer with integral electrical pins configured to provide electrical connections between electronic components on each side of the thermally conductive layer;
- using automatic placement equipment to position a magnetic partition adjacent to and on a first side of the thermal conduction partition, the magnetic partition comprising a transformer or inductor;
- using automatic placement equipment to position a capacitance partition on a second side of the thermal conduction partition, the capacitance partition comprising a capacitive electrical storage component;
- using automatic placement equipment to position a power switching partition adjacent to the thermal conduction partition such that the thermally conductive layer is in thermal contact with components in the power switching partition, the power switching partition comprising a power semiconductor component;
- and
- using automatic placement equipment to position a control partition adjacent to the capacitance partition, the control partition comprising digital logic;
- wherein each partition comprises a layer of components, and wherein most of the components in each partition provide a similar function.
4 more elements
Dependencies are inferred from the claim text.