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US 9,319,799 B2Granted
Microphone package with integrated substrate
AssigneeRobert Bosch GmbH
InventorJay Salmon
Life of this patent
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Abstract
MEMS microphone packages are described that include an ASIC integrated in the base substrate of the package housing. Methods of manufacturing the same and methods for separating individual microphone packages from wafer form assembly arrays are also described.
Claims6
A microelectromechanical system (MEMS) microphone package comprising:
- a base substrate layer including an acoustic port opening and an application specific integrated circuit formed as an integrated part of the base substrate layer;
- a lid coupled to the base substrate layer forming a package cavity between the base substrate layer and the lid;
- and
- a MEMS microphone component positioned within the package cavity and configured to receive acoustic pressures through the acoustic port opening in the base substrate layer, the MEMS microphone being electronically coupled to the application specific integrated circuit of the base substrate layer,
- wherein the base substrate layer further includes a tapered edge on an exterior surface of the base substrate layer around the acoustic port opening.
2 more elements
A microelectromechanical system (MEMS) microphone package comprising:
- a base substrate layer including an acoustic port opening and an application specific integrated circuit formed as an integrated part of the base substrate layer;
- a lid coupled to the base substrate layer forming a package cavity between the base substrate layer and the lid;
- and
- a MEMS microphone component positioned within the package cavity and configured to receive acoustic pressures through the acoustic port opening in the base substrate layer, the MEMS microphone being electronically coupled to the application specific integrated circuit of the base substrate layer,
- wherein the lid includes a top lid substrate layer and a spacer layer, wherein the spacer layer is at least partially hollow and is coupled between the top lid substrate layer and the base substrate layer to form a sealed package cavity between the base substrate layer and the top substrate layer.
2 more elements
Dependencies are inferred from the claim text.