MEMS microphone assembly and method of manufacturing the MEMS microphone assembly
AssigneeEpcos AG
InventorJan Tue Ravnkilde
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Abstract
The present invention concerns a MEMS microphone assembly (1) comprising a MEMS transducer element (2) comprising a MEMS die (3), a back plate (4) and a diaphragm (5) displaceable in relation to the back plate (4), and a sound inlet (16) for acoustically coupling the MEMS transducer element (2) to the exterior of the MEMS microphone assembly (1), wherein the MEMS die (3) comprises an indentation (17) that forms at least a part of the sound inlet (16). Further, the present invention concerns a method of manufacturing said MEMS microphone assembly (1).
Claims22
MEMS microphone assembly, comprising
- a MEMS transducer element comprising a MEMS die, a back plate and a diaphragm displaceable in relation to the back plate, and
- a sound inlet for acoustically coupling the MEMS transducer element to the exterior of the MEMS microphone assembly, wherein the MEMS die comprises an indentation that forms at least a part of the sound inlet.
Method of manufacturing a MEMS microphone assembly, comprising the steps of:
- providing a substrate,
- mounting a MEMS transducer element comprising a MEMS die, a back plate and a diaphragm displaceable in relation to the back plate on the substrate, wherein the MEMS die comprises an indentation,
- covering the MEMS transducer element with a sealing layer, and
- forming an opening in the sealing layer that is in acoustic contact with the indentation of the MEMS die such that a sound inlet for acoustically coupling the transducer element to the exterior of the MEMS microphone assembly is formed.
Dependencies are inferred from the claim text.